Title :
Surface mounted assembly of SIW circuits for flexible communication applications
Author :
Buiculescu, Valentin ; Costovici, Stefania
Author_Institution :
IMT - Bucharest, Bucharest, Romania
Abstract :
The paper presents a new connection topology intended for flexible integration of substrate-integrated waveguide (SIW) components, based on a building blocks concept. This connection type was experimentally validated on a model made of FR-4 substrate, by using printed circuit board (PCB) technology, with a bandwidth exceeding the regular 5 GHz unlicensed telecommunications frequency range. The measured results are in excellent agreement with simulated two-port parameters. The transition geometry is compatible with surface mounted technology (SMT).
Keywords :
printed circuits; substrate integrated waveguides; substrates; surface mount technology; FR-4 substrate; SIW circuits; connection topology; flexible communication application; flexible integration; printed circuit board technology; substrate-integrated waveguide components; surface mounted assembly; surface mounted technology; Assembly; Couplings; Electromagnetic waveguides; Microstrip; Microwave filters; Probes; Substrates; Substrate-integrated waveguide; building block; coplanar waveguide; coupling structure; microstrip line;
Conference_Titel :
Semiconductor Conference (CAS), 2011 International
Conference_Location :
Sinaia
Print_ISBN :
978-1-61284-173-1
DOI :
10.1109/SMICND.2011.6095761
