Title :
Teflon bonding of silicon solar cells
Author :
White, P.A. ; Jones, D.E.
Abstract :
The silicon adhesive used to bond coverglass onto a solar cell can be replaced by a thin layer of FEP Teflon. The advantage of using Teflon as the adhesive is that it is supplied as a thin sheet in thicknesses of 25 or 50 μm and can be cut to size prior to use. A review is presented of the work done to date on the Teflon bonding process including the results of some critical EOL tests
Keywords :
Bonding processes; Delamination; Electrostatics; Glass; Photovoltaic cells; Silicon; Temperature; Testing; Thermal expansion; Thermal stresses;
Conference_Titel :
Photovoltaic Specialists Conference, 1991., Conference Record of the Twenty Second IEEE
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-87942-636-5
DOI :
10.1109/PVSC.1991.169455
