DocumentCode :
2562987
Title :
Network flow based BSM asssignment
Author :
Xiang, Hua ; Ren, Haoxing ; Zhou, Tingdong
fYear :
2009
fDate :
18-20 May 2009
Firstpage :
67
Lastpage :
70
Abstract :
In current industry practice, Bottom Surface Metals (BSMs) assignment for high frequency signals on a package device is a tedious manual job. One often needs to change the assignment multiple times in order to produce a routable solution. This paper proposes a network flow based method to assign BSMs automatically. It constructs a network flow graph based on available routing resource, honoring constraints such as wiring/BSM blockages. Then it derives the BSM assignment from the min-cost max-flow solution. The resulting assignment is optimal in terms of routability and wirelength. In practice, some high speed signals require differential pair routing. This paper proposes a two-step BSM assignment algorithm to handle these differential pair constraints. The first step constructs a bi-partite graph which solves the BSM pairing problem automatically. The second step constructs a scaled flow graph to assign BSM pairs to differential pairs. Compared to the manual approach, these methods can provide an optimized solution which also significantly reduces the turn around time of board design process from days to seconds.
Keywords :
network routing; signal flow graphs; bipartite graph; bottom surface metal assignment; differential pair routing; high frequency signal; high speed signal; min-cost max-flow solution; network flow graph; package device; routability; routing resource; scaled flow graph; Flow graphs; Frequency; Integrated circuit interconnections; Metals industry; Packaging; Pins; Process design; Routing; Wires; Wiring;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
IC Design and Technology, 2009. ICICDT '09. IEEE International Conference on
Conference_Location :
Austin, TX
Print_ISBN :
978-1-4244-2933-2
Electronic_ISBN :
978-1-4244-2934-9
Type :
conf
DOI :
10.1109/ICICDT.2009.5166267
Filename :
5166267
Link To Document :
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