DocumentCode :
2563091
Title :
The negative bias temperature instability vs. high-field stress paradigm
Author :
Campbell, J.P. ; Cheung, K.P. ; Suehle, J.S. ; Oates, A.S.
Author_Institution :
Semicond. Electron. Div., Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA
fYear :
2009
fDate :
18-20 May 2009
Firstpage :
79
Lastpage :
82
Abstract :
A new and more accurate fast-IDVG measurement methodology is utilized to examine the transient degradation and recovery associated with the negative-bias temperature instability (NBTI). The results reveal that the anomalously large initial degradations reported in the recent literature are actually due to high-field stress acceleration and are not representative of low-field NBTI phenomena. Our observations at these higher fields reveal the presence of an, as yet unaccounted for, electron trapping/de-trapping component. The electron trapping is a signature of high-field stress degradation. While this high-field stress acceleration is unavoidable, care must be taken to account for this component in NBTI analysis. Collectively, our observations indicate that this high-field stress component is present and unaccounted for in a large portion of the recent NBTI literature.
Keywords :
MOSFET; electron traps; high field effects; transients; electron de-trapping component; electron trapping; high field stress acceleration; high field stress component; high field stress degradation; negative bias temperature instability; transient degradation; Acceleration; CMOS technology; Degradation; Electron traps; Negative bias temperature instability; Niobium compounds; Oscilloscopes; Stress measurement; Threshold voltage; Titanium compounds; NBTI; electron trapping; high-field stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
IC Design and Technology, 2009. ICICDT '09. IEEE International Conference on
Conference_Location :
Austin, TX
Print_ISBN :
978-1-4244-2933-2
Electronic_ISBN :
978-1-4244-2934-9
Type :
conf
DOI :
10.1109/ICICDT.2009.5166270
Filename :
5166270
Link To Document :
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