• DocumentCode
    2563578
  • Title

    Accelerated aging of extruded dielectric power cables. II. Life testing of 15 kV XLPE-insulated cables

  • Author

    Bernstein, Bruce S. ; Thue, William A. ; Walton, Mark D. ; Smith, John T., III

  • Author_Institution
    EPRI, Washington, DC, USA
  • fYear
    1991
  • fDate
    22-27 Sep 1991
  • Firstpage
    129
  • Lastpage
    134
  • Abstract
    For pt.I see ibid., p.122-8 (1991). Attempts to successfully use accelerated aging tests to quantify the life of medium voltage power cables in service have been elusive. Preliminary results are described in which 15 kV cross-linked polyethylene (XLPE) cables were subjected to accelerated aging tests under a variety of controlled voltage stress and thermal load cycle conditions, with loss of life being calculated for each set of conditions in terms of the geometric mean time to failure (GMTF). Voltage stress was applied to thin wall (0.76 mm) covered wires in a water bath of controlled nature in the core. Crosslinked polyethylene (XLPE), high molecular weight polyethylene (HMWPE), and ethylene-propylene rubber (EPR) insulations were studied
  • Keywords
    ageing; cable insulation; cable testing; insulation testing; life testing; organic insulating materials; polymers; power cables; 15 kV; XLPE-insulated cables; accelerated aging tests; cross-linked polyethylene; ethylene-propylene rubber; extruded dielectric power cables; geometric mean time to failure; high molecular weight polyethylene; life tests; loss of life; medium voltage power cables; thermal load cycle; thin wall covered wires; voltage stress; water bath; Accelerated aging; Dielectrics; Life testing; Medium voltage; Polyethylene; Power cables; Stress control; Thermal loading; Thermal stresses; Voltage control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Transmission and Distribution Conference, 1991., Proceedings of the 1991 IEEE Power Engineering Society
  • Conference_Location
    Dallas, TX
  • Print_ISBN
    0-7803-0219-2
  • Type

    conf

  • DOI
    10.1109/TDC.1991.169497
  • Filename
    169497