Title :
Thermal modeling of discrete microelectronic elements within three-dimensional continuous models
Author :
Creel, Kenneth E. ; Nelson, Douglas J.
Author_Institution :
Dept. of Mech. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
fDate :
29 May-1 Jun 1996
Abstract :
A method for incorporating the thermal effects of discrete microelectronics features (such as vias, wire bonds and pins) into conventional thermal analysis tools is described. The method uses the concept of equivalent thermal resistance and the input parameters of convective boundary conditions and volumetric source terms. Example results are given for a simplified multichip module illustrating the effects of each of these features
Keywords :
convection; cooling; integrated circuit modelling; integrated circuit packaging; multichip modules; thermal analysis; thermal resistance; convective boundary conditions; discrete microelectronic elements; equivalent thermal resistance; input parameters; multichip module; pins; thermal analysis tools; thermal modeling; three-dimensional continuous models; vias; volumetric source terms; wire bonds; Boundary conditions; Electronic packaging thermal management; Equations; Heat transfer; Microelectronics; Multichip modules; Nonhomogeneous media; Pins; Thermal resistance; Wire;
Conference_Titel :
Thermal Phenomena in Electronic Systems, 1996. I-THERM V., Inter-Society Conference on
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-3325-X
DOI :
10.1109/ITHERM.1996.534586
