• DocumentCode
    2564138
  • Title

    Partial discharge modelling in a spherical cavity within a dielectric insulation material as a function of frequency

  • Author

    Illias, H.A. ; Chen, G. ; Lewin, P.L.

  • Author_Institution
    Sch. of Electron. & Comput. Sci., Univ. of Southampton, Southampton, UK
  • fYear
    2009
  • fDate
    May 31 2009-June 3 2009
  • Firstpage
    55
  • Lastpage
    59
  • Abstract
    The measurement of partial discharge (PD) is used in the performance assessment of an insulation system in high voltage components. Through modeling the discharge process a better understanding of the phenomena may be attained. This paper is an extension from previous works by the same authors which have considered the modeling of PD activity from a spherical cavity by using Finite Element Analysis (FEA) method. However, this paper describes the development of an improved model for a spherical cavity within a homogeneous dielectric material. The model developed has been used to study the influence of applied frequency on PD activity. The model has also been used to simulate the PD measurement results. Therefore, parameters in the model that are affecting PD frequency dependent behavior can be identified through comparison between experimental measurement and simulation results.
  • Keywords
    dielectric materials; finite element analysis; insulation; partial discharge measurement; dielectric insulation material; finite element analysis; homogeneous dielectric material; partial discharge modelling; spherical cavity; Dielectric materials; Dielectric measurements; Dielectrics and electrical insulation; Electrons; Equations; Frequency dependence; Partial discharge measurement; Partial discharges; Surface discharges; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference, 2009. EIC 2009. IEEE
  • Conference_Location
    Montreal, QC
  • Print_ISBN
    978-1-4244-3915-7
  • Electronic_ISBN
    978-1-4244-3917-1
  • Type

    conf

  • DOI
    10.1109/EIC.2009.5166323
  • Filename
    5166323