Title :
Operational modeling and simulation in semiconductor manufacturing
Author :
Fowler, John W. ; Fu, Michael C. ; Schruben, Lee W. ; Brown, Steven ; Chance, Frank ; Cunningham, Sean ; Hilton, Courtland ; Janakiram, Mani ; Stafford, Rick ; Hutchby, James
Author_Institution :
Dept. of Ind. & Manage. Syst. Eng., Arizona State Univ., Tempe, AZ, USA
Abstract :
We present a panel session on the role of simulation in improving semiconductor fab operations. The participants include three principal investigators (PIs) from the recently awarded three-year, $1.2 million contracts sponsored jointly by the National Science Foundation (NSF) and the Semiconductor Research Corporation (SRC) on Operational Methods in Semiconductor Manufacturing; the Factory Sciences Program Director from SRC; and industry representatives from the semiconductor manufacturers and from discrete-event simulation vendors. Included are initial position statements from the various participants, which formed the basis for the panel discussions. For the industry participants, the statements may include, but were not limited to, specific important problems related to the role of simulation in operations in their respective companies, noting any significant technical, managerial, market, or other barriers. The position statements of the academic PIs describe the role that simulation is expected to play in their ongoing research in semiconductor manufacturing and/or their views on the key to successful application of simulation in the industry
Keywords :
computer integrated manufacturing; digital simulation; semiconductor device manufacture; National Science Foundation; Semiconductor Research Corporation; discrete-event simulation vendors; operational modeling; semiconductor manufacturing; simulation; Analytical models; Computational modeling; Contracts; Educational institutions; Manufacturing industries; Medical simulation; Production facilities; Productivity; Semiconductor device manufacture; Virtual manufacturing;
Conference_Titel :
Simulation Conference Proceedings, 1998. Winter
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-5133-9
DOI :
10.1109/WSC.1998.745841