• DocumentCode
    2564815
  • Title

    Design and analysis of a novel two DOF thermal micromanipulator

  • Author

    Pourzand, Hoorad ; Ghaemi, Reza ; Alasty, Aria

  • Author_Institution
    Mech. Eng. Dept., Sharif Univ. of Technol., Tehran, Iran
  • fYear
    2011
  • fDate
    13-15 April 2011
  • Firstpage
    654
  • Lastpage
    659
  • Abstract
    In this paper, a novel thermal microactuator is designed which is capable of producing bi-directional lateral and rotational output and one of its applications as a two DOF micromanipulator is shown. Also, by carefully choosing the doping level, temperature distribution is determined by considering the dependency of silicon´s resistivity and conductivity to temperature. Using variable separation method an equation in terms of elliptic integrals is reached and after imposing boundary conditions the exact temperature distribution is obtained numerically. Currents at each branch is updated due to the last temperature distribution and this process is repeated several times until the final thermal distribution is reached with less than 0.1 percent change in two following computed currents. Furthermore, By using equations of postbuckling behavior of a cantilever subjected to tip multiple loading, deflections of flexible joints and computed linear axial and flexural stiffness of a box spring, a numerical approach has been developed to find output displacement of the micromanipulator.
  • Keywords
    microactuators; micromanipulators; temperature distribution; thermal conductivity; DOF thermal micromanipulator; bidirectional lateral output; box spring; cantilever postbuckling behavior; elliptic integral; linear axial; rotational output; silicon conductivity; silicon resistivity; temperature distribution; thermal microactuator; variable separation method; Finite element methods; Heating; Jacobian matrices; Micromanipulators; Polymers; Voltage control; Elliptic temperature distribution; Input voltage controlled; Large deformation; Manipulator; Thermal microactuator;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mechatronics (ICM), 2011 IEEE International Conference on
  • Conference_Location
    Istanbul
  • Print_ISBN
    978-1-61284-982-9
  • Type

    conf

  • DOI
    10.1109/ICMECH.2011.5971197
  • Filename
    5971197