• DocumentCode
    2564911
  • Title

    Study on the effect of humidity on dielectric response and partial discharges activity of machine insulation materials

  • Author

    Soltani, Reza ; David, Eric ; Lamarre, Laurent

  • Author_Institution
    Ecole de Technol. Super., Montreal, QC, Canada
  • fYear
    2009
  • fDate
    May 31 2009-June 3 2009
  • Firstpage
    343
  • Lastpage
    347
  • Abstract
    Operational and environmental conditions can affect the dielectric response of the insulation system of large rotating machines. Humidity is one of the well-known environmental parameters which could affect dielectric parameters such as insulation resistance, polarization index and dissipation factor up to a certain degree. It also could affect partial discharges occurring in rotating electrical machines with open ventilated cooling system. In order to investigate the effect of humidity on the characteristics of different insulation systems, one asphalt coil and one epoxy bar were subjected to high humidity for a certain period of time and the humidity effect on time and frequency domain dielectric responses were studied. Also partial discharge measurements were conducted on two samples to study the possible correlation between partial discharges and changes in other parameters such as insulation resistance and polarization index due to exposure to high humidity.
  • Keywords
    asphalt; dielectric materials; electric machines; epoxy insulation; humidity; insulator contamination; machine insulation; partial discharges; asphalt coil; dielectric response; epoxy bar; humidity effect; insulation resistance; machine insulation materials; open ventilated cooling; partial discharges activity; polarization index; rotating electrical machine; Asphalt; Cooling; Dielectric devices; Dielectric materials; Dielectrics and electrical insulation; Electric resistance; Humidity; Partial discharges; Polarization; Rotating machines;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference, 2009. EIC 2009. IEEE
  • Conference_Location
    Montreal, QC
  • Print_ISBN
    978-1-4244-3915-7
  • Electronic_ISBN
    978-1-4244-3917-1
  • Type

    conf

  • DOI
    10.1109/EIC.2009.5166368
  • Filename
    5166368