• DocumentCode
    2565218
  • Title

    Form wound stator insulation system under different voltage waveform stresses

  • Author

    Yu, Ya Tong ; Jayaram, Shesha H.

  • Author_Institution
    Electr. & Comput. Eng. Dept., Univ. of Waterloo, Waterloo, ON, Canada
  • fYear
    2009
  • fDate
    May 31 2009-June 3 2009
  • Firstpage
    425
  • Lastpage
    429
  • Abstract
    The paper presents the experimental results under power frequency, exponential decay pulse, square and sinusoidal pulse width modulated (SPWM) voltage waveforms, with the same peak values, applied to the insulation system of a form wound stator coil. Both the infrared images and the maximum temperature rise of the coil under different electrical stresses were recorded. Results show that the temperature rise of the coil surface under square wave or SPWM wave stress are much higher than the temperature rise observed under the stress of power frequency sinusoidal voltage or exponential decay pulses. FFT analysis shows that both the square and SPWM waveforms used in this study contain significantly higher harmonic components, similar to a real drive output voltage; hence resulted in a higher temperature rise compared to the other voltage waveforms used. Thus, neither the power frequency sinusoidal voltage nor the fast repetitive exponential decay type pulsed voltage can fully represent the transients caused by a voltage waveform of a real drive; voltage source converter.
  • Keywords
    PWM power convertors; coils; fast Fourier transforms; machine insulation; stators; FFT analysis; electrical stresses; exponential decay pulse; fast Fourier transforms; form wound stator coil insulation system; infrared images; power frequency; sinusoidal pulse width modulated voltage waveforms; square waveform; voltage source converter; voltage waveform stresses; Coils; Frequency; Insulation; Pulse width modulation; Space vector pulse width modulation; Stators; Stress; Temperature; Voltage; Wounds;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference, 2009. EIC 2009. IEEE
  • Conference_Location
    Montreal, QC
  • Print_ISBN
    978-1-4244-3915-7
  • Electronic_ISBN
    978-1-4244-3917-1
  • Type

    conf

  • DOI
    10.1109/EIC.2009.5166384
  • Filename
    5166384