DocumentCode
2565548
Title
Feature analysis of acoustic emission signals in Time-Frequency representation from partial discharge sources using Self-Organizing Map
Author
Zakaria, Z. ; Thayoob, Y. H Md ; Samsudin, M.R. ; Ghosh, P.S. ; Chai, M.L.
Author_Institution
Dept. of Electr. Power Eng., Univ. Tenaga Nasional, Kajang, Malaysia
fYear
2009
fDate
18-19 Nov. 2009
Firstpage
542
Lastpage
547
Abstract
Electrical systems throughout the world are experiencing problems with aging insulation. One of the major components, which degrade under stresses, is the paper insulation of a power transformer. In this research work, analysis of acoustic emission (AE) signal patterns due to the occurrence of partial discharge (PD) has been carried out. In order to characterize the different types of PD sources, seven descriptors or features were extracted from the Short-Time Fourier Transform spectrogram of the AE signals. These descriptors are used to generate the Self-Organizing Map (SOM) for three different types of PD sources. From the component planes of the descriptors produced by the SOM map, the analysis of the features was carried out and the best features to represent the AE signal patterns in the Time-Frequency representation were selected.
Keywords
acoustic emission; feature extraction; partial discharges; power engineering computing; power transformer insulation; self-organising feature maps; signal representation; time-frequency analysis; acoustic emission signals; aging insulation; feature analysis; feature extraction; paper insulation; partial discharge sources; power transformer; self-organizing map; time-frequency representation; Acoustic emission; Aging; Degradation; Dielectrics and electrical insulation; Partial discharges; Pattern analysis; Power transformer insulation; Signal analysis; Stress; Time frequency analysis; Acoustic Emission(AE); Partial Discharge sources; Self-Organizing Map(SOM); Time-frequency representation;
fLanguage
English
Publisher
ieee
Conference_Titel
Signal and Image Processing Applications (ICSIPA), 2009 IEEE International Conference on
Conference_Location
Kuala Lumpur
Print_ISBN
978-1-4244-5560-7
Type
conf
DOI
10.1109/ICSIPA.2009.5478716
Filename
5478716
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