• DocumentCode
    2566286
  • Title

    Where CMOS is going: trendy hype vs. real technology

  • Author

    Tze-chiang Chen

  • Author_Institution
    T.J. Watson Res. Center, Yorktown Heights, NY
  • fYear
    2006
  • fDate
    6-9 Feb. 2006
  • Firstpage
    1
  • Lastpage
    18
  • Abstract
    The development of silicon technology has been, and will continue to be, driven by system needs. Traditionally, these needs have been satisfied by the increase in transistor density and performance, as suggested by \´Moore\´s Law" and guided by CMOS scaling theory. As the silicon industry moves towards the 45nm node and beyond, the two most important challenges cited are the growing standby power dissipation and the increasing variability in device characteristics. These complaints are cited as the reason Moore\´s Law is "broken", or why CMOS scaling is coming to an end. Actually, these effects are the embodiments of CMOS technology\´s approach to atomistic and quantum-mechanical physics boundaries. However, the infusion of new materials and device structures will extend the development lifetime of silicon CMOS by at least ten years. Cooperative circuit/technology co-design, and architectures developed concurrently with these new device innovations will provide a comprehensive solution to the challenges of deep submicron CMOS
  • Keywords
    CMOS integrated circuits; semiconductor technology; silicon; CMOS scaling theory; Moore Law; quantum-mechanical physics boundaries; real technology; silicon industry; silicon technology; transistor density; CMOS technology; Circuit synthesis; Computer architecture; Moore´s Law; Power dissipation; Quantum computing; Silicon; Technological innovation; Temperature; Tunneling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference, 2006. ISSCC 2006. Digest of Technical Papers. IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0193-6530
  • Print_ISBN
    1-4244-0079-1
  • Type

    conf

  • DOI
    10.1109/ISSCC.2006.1696029
  • Filename
    1696029