Title :
Considering some undesired effects due to dense packing in supported coplanar waveguide MMICs by using combined methods
Author :
Wolff, I. ; Kiefer, D. ; Bedair, S.S.
Author_Institution :
Dept. of Electr. Eng., Duisburg Univ., West Germany
Abstract :
Combined methods are used to predict some undesired effects due to dense packing in supported coplanar waveguide monolithic microwave integrated circuits (MMICs). These include the effects due to the presence of an adjacent grounded side wall or the presence of another adjacent line. The presented information can be used to consider these effects during the design stage or to help in designing MMICs in which these effects can be ignored. Numerical results are presented in order to demonstrate these effects.<>
Keywords :
MMIC; circuit CAD; waveguides; CPW; MMICs; adjacent grounded side wall; adjacent line; combined methods; dense packing effects; monolithic microwave integrated circuits; supported coplanar waveguide; Conformal mapping; Coplanar waveguides; Coupling circuits; Dielectric materials; Dielectric substrates; MMICs; Microwave integrated circuits; Microwave theory and techniques; Monolithic integrated circuits; Planar waveguides;
Conference_Titel :
Microwave Symposium Digest, 1989., IEEE MTT-S International
Conference_Location :
Long Beach, CA, USA
DOI :
10.1109/MWSYM.1989.38811
