DocumentCode :
2566795
Title :
Low-Power Low-Cost Implementation of IEEE 802.15.4 in WiSN SoC Design
Author :
Luo, Ao ; Yin, Shouyi ; Liu, Leibo ; Zhou, Renyan ; Wei, Shaojun
Author_Institution :
Res. Center for Mobile Comput., Tsinghua Univ., Beijing, China
fYear :
2010
fDate :
23-25 Sept. 2010
Firstpage :
1
Lastpage :
4
Abstract :
This article presents the hardware software co-optimized implementation of the IEEE 802.15.4 protocol for a Wireless image Sensor Network (WiSN) node SoC. In order to to minimize the power consumption and hardware software implementation cost, a power and cost aware partition scheme is introduced. Then the optimized hardware accelerator is designed and validated with software driver/stack based on TinyOS platform. The IP is integrated and verified in the SoC for wireless image sensor network. The results indicated that, with 0.58 mm2 area and less than 18 Kbytes driver/stack cost, the hardware /software implementation of IEEE 802.15.4 is better than the most popular implementations in both functionality and code size requirement. Besides, benefited from the co-optimization, the micro controller workload is greatly reduced and the total protocol processing power consumption is only about 3 mW with 12 MHz 8051 processer in typical image transmission scenario, which shows a 40% reduction compared to pure software implementation.
Keywords :
hardware-software codesign; low-power electronics; system-on-chip; wireless sensor networks; IEEE 802.15.4 protocol; TinyOS platform; WiSN SoC design; cost aware partition; hardware software cooptimized implementation; hardware software implementation cost; low-power low-cost implementation; microcontroller workload; optimized hardware accelerator; power consumption; wireless image sensor network; Hardware; Power demand; Protocols; Software; System-on-a-chip; Wireless communication; Wireless sensor networks;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Wireless Communications Networking and Mobile Computing (WiCOM), 2010 6th International Conference on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4244-3708-5
Electronic_ISBN :
978-1-4244-3709-2
Type :
conf
DOI :
10.1109/WICOM.2010.5601349
Filename :
5601349
Link To Document :
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