DocumentCode
2566875
Title
A 3 DOF model for an electro magnetic air mount
Author
Kim, HyungTae ; Kim, CheolHo ; Kang, SungBok ; Lee, KangWon ; Baek, JaeHo ; Han, HyunHee
Author_Institution
Manuf. Syst. Div., KITECH, CheonAn, South Korea
fYear
2011
fDate
13-15 April 2011
Firstpage
29
Lastpage
33
Abstract
A model with three degrees of freedom is proposed as a means for controlling for controlling micro vibrations in semiconductor manufacturing. The model was derived from an assumption based on small and low frequency vibrations. The coordinates of the 3 DOF was composed of a vertical position, pitch, roll and a proof term. The coordinates of the 4 variables can be calculated from the 4 positions in an isolator. This coordinate can be written as a 4 × 4 matrix, which possesses inversive full rank. The proposed algorithm was applied to an electro-magnetic isolator. The active isolator consisted of a heavy surface plate, sensors, electro-magnetic actuators, amps, air springs and a DSP controller. The electro-magnetic actuator was installed in a pneumatic chamber of the individual air spring. The active isolator was experimentally used as a base structure under the semiconductor manufacturing machines. The performance of the 3 DOF model was compared with that of a 1 DOF model in an impact test. The settling time was reduced to 25% in the experiment.
Keywords
electromagnetic actuators; microactuators; pneumatic actuators; semiconductor device manufacture; semiconductor device models; springs (mechanical); vibration control; 3 DOF model; DSP controller; active isolator; air spring; amps; electromagnetic actuator; electromagnetic air mount; electromagnetic isolator; frequency vibration; heavy surface plat; inversive full rank; microvibration control; pneumatic chamber; semiconductor manufacturing machine; sensor; Actuators; Atmospheric modeling; Magnetomechanical effects; Sensors; Springs; Vibrations; Active vibration control; Air mount; Electro-magnetic actuator; Pneumatic spring; Resonance Frequency;
fLanguage
English
Publisher
ieee
Conference_Titel
Mechatronics (ICM), 2011 IEEE International Conference on
Conference_Location
Istanbul
Print_ISBN
978-1-61284-982-9
Type
conf
DOI
10.1109/ICMECH.2011.5971310
Filename
5971310
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