• DocumentCode
    2566937
  • Title

    A microfabricated three-degree-of-freedom parallel mechanism

  • Author

    Behi, Fariborz ; Mehregany, Mehran ; Gabriel, Kaigham

  • Author_Institution
    AT&T Bell Lab., Holmdel, NJ, USA
  • fYear
    1990
  • fDate
    11-14 Feb 1990
  • Firstpage
    159
  • Lastpage
    165
  • Abstract
    A microfabricated, three-degree-of-freedom, passive, closed-chain, planar mechanism with the potential for low-torque precision positioning applications is presented. A parallel-link mechanism design is selected rather than a serial-link implementation, since parallel-link mechanisms can operate with stationary actuators and are more rigid than their serial counterparts. Polysilicon surface micromachining is used to fabricate a mechanism which has a total area of 0.13 mm2 and a workspace of approximately 0.01 mm2. The fabrication process for the mechanism is described, identifying the effect on device performance of constraints imposed by the microfabrication; most notably joint clearances, component nonplanarity, and residual-stress-induced linkage deformations. The requisite formulations for the kinematics and dynamics of the device are presented which, in conjunction with the documented measurements of friction on structures of similar geometry and material, indicate that the dominant torque loads are due to friction
  • Keywords
    electric actuators; kinematics; robots; component nonplanarity; degree of freedom; joint clearances; kinematics; low-torque precision positioning applications; microfabrication; micromachining; parallel-link mechanism design; planar mechanism; polysilicon surface; residual-stress-induced linkage deformations; stationary actuators; torque loads; Actuators; Appropriate technology; Couplings; Fabrication; Friction; Kinematics; Micromachining; Micromotors; Silicon; Torque measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 1990. Proceedings, An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots. IEEE
  • Conference_Location
    Napa Valley, CA
  • Type

    conf

  • DOI
    10.1109/MEMSYS.1990.110269
  • Filename
    110269