• DocumentCode
    2567011
  • Title

    Three dimensional palmprint recognition

  • Author

    Li, Wei ; Zhang, Lei ; Zhang, David

  • Author_Institution
    Inst. of Image Process. & Pattern Recognition, Shanghai Jiao Tong Univ., Shanghai, China
  • fYear
    2009
  • fDate
    11-14 Oct. 2009
  • Firstpage
    4847
  • Lastpage
    4852
  • Abstract
    Palmprint has been widely studied as its high accuracy and low cost. Most of the previous studies are based on two dimensional (2D) image of the palmprint. However, 2D image can be easily forged, which will threaten the security of palmprint authentication system. Furthermore, 2D image can be easily affected by noise, such as scrabbling and dirty in the palm. To overcome these shortcomings, we develop a three dimensional (3D) palmprint identification system. The structured-light imaging technology is adopted to collect the 3D palmprint data, from which the stable mean curvature image (MCI) is extracted. Then the competitive coding (CompCode) technique is used to code the 3D palmprint pattern according the MCI. By using score level fusion of MCI and its CompCode, promising recognition performance is achieved on our established 3D palmprint database.
  • Keywords
    biometrics (access control); feature extraction; image coding; image fusion; image recognition; 3D palmprint recognition; competitive coding technique; mean curvature image extraction; palmprint authentication system; score level fusion; structured-light imaging technology; Authentication; Biometrics; Costs; Data acquisition; Data security; Image recognition; Image reconstruction; Pattern recognition; Surface reconstruction; Time measurement; 3D palmprint identification; biometrics; feature coding; mean curvature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Systems, Man and Cybernetics, 2009. SMC 2009. IEEE International Conference on
  • Conference_Location
    San Antonio, TX
  • ISSN
    1062-922X
  • Print_ISBN
    978-1-4244-2793-2
  • Electronic_ISBN
    1062-922X
  • Type

    conf

  • DOI
    10.1109/ICSMC.2009.5346053
  • Filename
    5346053