• DocumentCode
    2567889
  • Title

    Local Source Plasma Ion Implantation

  • Author

    Tian, X.B. ; Jiang, H.F. ; Cui, J.T. ; Yang, S.Q. ; Fu, R.K.Y. ; Chu, Paul K.

  • Author_Institution
    Sch. of Mater. Sci. & Eng., Harbin Inst. of Technol.
  • fYear
    2005
  • fDate
    20-23 June 2005
  • Firstpage
    148
  • Lastpage
    148
  • Abstract
    Summary form only given. During conventional plasma ion implantation, the plasmas are generated uniformly in the vacuum chamber and then the target to be treated is negatively biased. Consequently, all the exposed surfaces are implanted simultaneously. In this paper, a novel plasma ion implantation technique referred to as local source plasma ion implantation is presented. The plasma is produced only near the surfaces to be implanted. The plasma is sustained using the hollow cathode radio-frequency discharge mode with or without assistance of external magnetic field. In conjunction with the previously proposed concept of non-uniform plasma ion implantation, the technique is more suitable for implantation of local areas, for instance, local part of a large component, side wall of trench, inner surfaces of cylindrical bore, etc. The paper focuses on the plasma dynamics and influence of the processing parameters on the implantation behavior
  • Keywords
    glow discharges; high-frequency discharges; plasma immersion ion implantation; plasma sources; plasma-wall interactions; cylindrical bore; external magnetic field; hollow cathode radiofrequency discharge; local source plasma ion implantation; plasma dynamics; Cathodes; Fault location; Ion implantation; Magnetic fields; Plasma immersion ion implantation; Plasma materials processing; Plasma sources; Radio frequency; Surface discharges; Surface treatment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Plasma Science, 2005. ICOPS '05. IEEE Conference Record - Abstracts. IEEE International Conference on
  • Conference_Location
    Monterey, CA
  • ISSN
    0730-9244
  • Print_ISBN
    0-7803-9300-7
  • Type

    conf

  • DOI
    10.1109/PLASMA.2005.359138
  • Filename
    4198397