• DocumentCode
    2568567
  • Title

    Similitude in electronics cooling: scaling and design of experiments

  • Author

    Boyle, Michael T.

  • Author_Institution
    Dept. of Mech. Eng., Maine Univ., Orono, ME, USA
  • fYear
    1990
  • fDate
    6-8 Feb 1990
  • Firstpage
    49
  • Abstract
    Summary form only given. A tutorial that establishes procedures that can be employed to identify the variables that are important to characterizing aero-thermal problems is summarized. The discussion ranged from a seat-of-the-pants manipulation of experimental data to a more rigorous derivation of the minimum number of variables required to describe a problem. Practical sample problems applied to electronics cooling geometries were presented as examples of the process of variable identification
  • Keywords
    cooling; flow; packaging; printed circuit design; air flow dynamics; characterizing aero-thermal problems; design of experiments; electronics cooling; forced convection cooling; minimum number of variables required; rigorous derivation; scaling; seat-of-the-pants manipulation of experimental data; tutorial; variable identification; Aerodynamics; Data engineering; Electronic components; Electronics cooling; Erbium; Geometry; Hydrodynamics; Mechanical engineering; Numerical models; Solid modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal and Temperature Measurement Symposium, 1990. SEMI-THERM VI, Proceedings., Sixth Annual IEEE
  • Conference_Location
    Phoenix, AZ
  • Type

    conf

  • DOI
    10.1109/STHERM.1990.68489
  • Filename
    68489