Title :
Similitude in electronics cooling: scaling and design of experiments
Author :
Boyle, Michael T.
Author_Institution :
Dept. of Mech. Eng., Maine Univ., Orono, ME, USA
Abstract :
Summary form only given. A tutorial that establishes procedures that can be employed to identify the variables that are important to characterizing aero-thermal problems is summarized. The discussion ranged from a seat-of-the-pants manipulation of experimental data to a more rigorous derivation of the minimum number of variables required to describe a problem. Practical sample problems applied to electronics cooling geometries were presented as examples of the process of variable identification
Keywords :
cooling; flow; packaging; printed circuit design; air flow dynamics; characterizing aero-thermal problems; design of experiments; electronics cooling; forced convection cooling; minimum number of variables required; rigorous derivation; scaling; seat-of-the-pants manipulation of experimental data; tutorial; variable identification; Aerodynamics; Data engineering; Electronic components; Electronics cooling; Erbium; Geometry; Hydrodynamics; Mechanical engineering; Numerical models; Solid modeling;
Conference_Titel :
Semiconductor Thermal and Temperature Measurement Symposium, 1990. SEMI-THERM VI, Proceedings., Sixth Annual IEEE
Conference_Location :
Phoenix, AZ
DOI :
10.1109/STHERM.1990.68489
