• DocumentCode
    2568651
  • Title

    A Framework for Modeling Impact of Intrinsic Parameter Fluctuations at Architectural-Level

  • Author

    Ahmed, Rabah A. ; Samsudin, K. ; Rokhani, F.Z.

  • Author_Institution
    Dept. of Comput. & Commun. Syst., Univ. Putra Malaysia, Serdang, Malaysia
  • fYear
    2009
  • fDate
    15-17 May 2009
  • Firstpage
    574
  • Lastpage
    577
  • Abstract
    As the semiconductor process technology continues to scale deeper into the nanometer region, the intrinsic parameter fluctuations will aggressively affect the performance of future microprocessors. Therefore one of the challenge of advanced CMOS manufacturing lies in modeling and simulating the intrinsic parameter fluctuations for accurately assessing the performance and the yield of the corresponding integrated circuits (ICs). To investigate the impact of IPF at architectural-level, a framework to bridge architecture-level and device-level simulation will be presented. In this work, the framework will include intrinsic parameter fluctuation information from UTB-SOI transistors within the 25 nm and 13 nm technology node into architectural-level simulation. The impact of discrete random dopants in the source/drain regions, line edge roughness and body-thickness variations on a microprocessor cache memory system will be presented.
  • Keywords
    CMOS integrated circuits; cache storage; integrated circuit manufacture; microprocessor chips; silicon-on-insulator; UTB-SOI transistor; advanced CMOS manufacturing; architectural-level simulation; device-level simulation; discrete random dopants; integrated circuit; intrinsic parameter fluctuation; microprocessor; microprocessor cache memory system; semiconductor process technology; size 13 nm; size 25 nm; source-drain region; ultrathin-body SOI MOSFET; CMOS technology; Circuit simulation; Fluctuations; Integrated circuit manufacture; Integrated circuit modeling; Microprocessors; Semiconductor device manufacture; Semiconductor device modeling; Semiconductor process modeling; Virtual manufacturing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    2009 International Conference on Signal Processing Systems
  • Conference_Location
    Singapore
  • Print_ISBN
    978-0-7695-3654-5
  • Type

    conf

  • DOI
    10.1109/ICSPS.2009.89
  • Filename
    5166852