Title :
Experimental Investigation of Program Voltage (20 V) Generation With Boost Converter for 3-D-Stacked NAND Flash SSD
Author :
Hatanaka, Teruyoshi ; Johguchi, Koh ; Takeuchi, Ken
Author_Institution :
Dept. of Electr., Electron. & Commun. Eng., Chuo Univ., Hachioji, Japan
Abstract :
This paper experimentally demonstrates program voltage (20 V) generation under emulated condition of a 3-D solid-state drive (3-D-SSD) which vertically integrates boost converter on an flame retardant type 4-interposer and Si-chips. The proposed program voltage generator is a boost converter using a coil on the interposer. A measured peak magnetic field power is approximately -49 dBm above the coil, which satisfies the international regulation. The magnetic field induces the eddy current in a conductor material. The eddy current degrades the boost converter performance due to the lowered effective inductance of the coil. The effects on the performance of the boost converter as a function of the distance from the coil to the conductor are experimentally investigated. A 3-D-SSD requires a >0.84-mm space between the coil and conductor to generate the program voltage. By inserting NAND flash memory chips between the coil and the conductor, a 3-D-SSD can be successfully realized without the output voltage degradation.
Keywords :
NAND circuits; coils; eddy currents; elemental semiconductors; flash memories; magnetic fields; power convertors; silicon; three-dimensional integrated circuits; 3D-stacked NAND flash SSD; NAND flash memory chips; boost converter performance; coil; conductor material; eddy current; emulated condition; flame retardant type 4-interposer; international regulation; interposer; measured peak magnetic field power; program voltage generation; silicon-chips; solid-state drive; voltage 20 V; Ash; Coils; Conductors; Current measurement; Eddy currents; Semiconductor device measurement; Voltage measurement; Boost converter; NAND flash memory; electromagnetic interference (EMI); magnetic field; solid-state drive (SSD); solid-state drive (SSD).;
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCPMT.2014.2381267