• DocumentCode
    2569911
  • Title

    A Novel Analytical Solution of the Thermal Boundary-Layer over a Flat Plate with a Convective Surface Boundary Condition Using DTM-Padé

  • Author

    Rashidi, M.M. ; Erfani, E.

  • Author_Institution
    Eng. Fac., Bu-Ali Sina Univ., Hamedan, Iran
  • fYear
    2009
  • fDate
    15-17 May 2009
  • Firstpage
    905
  • Lastpage
    909
  • Abstract
    In this paper, a novel analytical method (DTM-Pade) is proposed for solving nonlinear differential equations, especially for boundary-layer and natural convection problems. This method is based on combination of the differential transform method and the Pade approximant that we use for solve the thermal boundary-layer over a flat plate with a convective surface boundary condition. This technique is extended to give solutions for nonlinear differential equations whit boundary conditions at the infinity. In order to show the effectiveness of the DTM-Pade, the results obtained from the DTM-Pade is compared with available solutions obtained using Runge-Kutta-Fehlberg fourth-fifth order (RFK45) method to generate the numerical solution. Numerical comparisons between the DTM-Pade and the RFK45 reveal that the new technique introduced here is a promising tool for solving nonlinear differential equations whit infinity boundary conditions.
  • Keywords
    Runge-Kutta methods; boundary layers; flow simulation; natural convection; nonlinear differential equations; DTM-Pade analytical method; Pade approximant; Runge-Kutta-Fehlberg fourth-fifth order method; convective surface boundary condition; differential transform method; natural convection; nonlinear differential equations; thermal boundary-layer; Boundary conditions; Differential equations; H infinity control; Integral equations; Nonlinear equations; Partial differential equations; Perturbation methods; Physics; Plasma waves; Transforms;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    2009 International Conference on Signal Processing Systems
  • Conference_Location
    Singapore
  • Print_ISBN
    978-0-7695-3654-5
  • Type

    conf

  • DOI
    10.1109/ICSPS.2009.197
  • Filename
    5166922