DocumentCode :
2570117
Title :
Fabrication of Microlens Arrays by Using Nano-Particle Fluid Imprinting Technology
Author :
Weng, Yung-Jin ; Weng, Yung-Chun ; Huang, Jen-Ching ; Wong, Yong-Cheng ; Yang, Sen-Yeu ; Liu, Hsu-Kang
Author_Institution :
Center for Gen. Educ., Kainan Univ., Taoyuan, Taiwan
fYear :
2009
fDate :
15-17 May 2009
Firstpage :
963
Lastpage :
966
Abstract :
In this study, we look into an innovative technology which utilizes nano-particles as a medium for imprinting. This technology integrates the advantages of soft lithography, photo-cure resist, and gas assisted imprinting. We try to produce micro-lens arrays by gas-assisted nano-particles based soft mould imprinting on photo-cure resists. It helps the application and technology of nano-imprinting becoming more sophisticated. We find that PDMS can be used to precisely replicate micro-to-nano-meter level micro-structures. Together with nano-particles and well-proportioned gas pressure, we can construct a perfect shape of micro-structures and achieve a conformal contact with the surface of base material. It increases the effective imprinting area significantly and improves the replication capability of the transfer. Meanwhile, the PDMS soft mould is easy for production and fast in replication, which reduces the cost remarkably. Furthermore, it has a low surface free energy and low viscosity to the resists. Integrating gas assisted nano-particles imprinting can be a great advantage in the process of micro-structure.
Keywords :
microlenses; soft lithography; conformal contact; gas assisted imprinting; microlens arrays; nano-particle fluid imprinting technology; photo-cure resist; soft lithography; Costs; Educational technology; Fabrication; Lenses; Lithography; Mechanical engineering; Microoptics; Microstructure; Polymers; Resists; Conformal contact; Fluid Imprinting; PDMS soft mold; Residual layer;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
2009 International Conference on Signal Processing Systems
Conference_Location :
Singapore
Print_ISBN :
978-0-7695-3654-5
Type :
conf
DOI :
10.1109/ICSPS.2009.188
Filename :
5166934
Link To Document :
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