Development of a flexible interconnection and a preliminary study toward reducing package size

Author

Mitsui, R. ; Takahashi, S. ; Nakajima, S.-I.

Author_Institution

Japan Aviation Electron. Ind. Ltd., Akishima, Japan

fYear

2014

fDate

7-10 Oct. 2014

Firstpage

360

Lastpage

362

Abstract

A reliability of a flexible interconnection using a film-type connector is investigated and compared to a conventional anisotropic conductive film (ACF) joint by measuring the change in contact resistance through folding tests. A film-type connector with thickness of less than 0.1 mm is composed of a base substrate, an adhesive layer which deforms elastically against pressure applied in a connection procedure, and electrodes arranged on the adhesive layer. Results of tests show that the flexible interconnection has some advantages compared to the ACF joint in contact resistance stability. A foldable connection technology has a possibility to make a contribution to future packaging.

Keywords

adhesives; contact resistance; elastic deformation; electric connectors; electrodes; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; ACF joint; adhesive layer; anisotropic conductive film joint; base substrate; contact resistance stability; elastic deformation; electrodes; film-type connector; flexible interconnection reliability; foldable connection procedure technology; folding tests; package size reduction; preliminary study development; Connectors; Contact resistance; Electrodes; Integrated circuit interconnections; Joints; Reliability; Substrates; fine-pitch interconnection; flexible electronics; foldability; reducing package size; reliability;

fLanguage

English

Publisher

ieee

Conference_Titel

Consumer Electronics (GCCE), 2014 IEEE 3rd Global Conference on

Conference_Location

Tokyo

Type

conf

DOI

10.1109/GCCE.2014.7031264

Filename

7031264