Thermal characteristics of TAB for small systems

The thermal bounds of the tape automated bonding (TAB) module in relation to other similar packaging structures are evaluated in order to obtain insight into the useful application of the TAB component. The thermal effects of natural or forced convection cooling, component placement, and circuit card orientation have been determined for the TAB component in a steady-state operating condition. Also included is the effect of locating the low profile TAB module in the downstream wake of larger surface mount or pin grid array components. Experimental data which demonstrate the power limitations of the TAB components for parameters that encompass machine configurations ranging from personal computer workstations to midsize mainframes are presented. The results of this study provide an indication of the thermal limitations of the TAB structure and indicate initial ground rules that should be incorporated into the placement of a T.AB component for optimum thermal performance