Third type interconnection architecture for the 3D MP-SoC design

This paper presents a method of design for three dimensional multi-processor system on chip (3D MP-SoC); specifically, we recommend a three dimension direct access multi-port memory (3D DA-MPM) architecture using wafer stack technology. First, we illustrate the data transfer process between multi-port memories with simulation waveforms. Next, we resolve the data transfer path routing problem using the solution of the master interface access. Then, we compare the interconnection area dissipation and analyze the character of DA-MPM based interconnection architecture for 3D MP-SoC design. And finally, we evaluate the 3D MP-SoC performance including interconnect area reduction, interconnect delay improvement, and yield improvement due to global wire shorting.