Automated reconstruction of 3D object on embedded system for mobile apps

Author

Yu-Hsien Sung ; Muchtar, K. ; Hsiang-Erh Lai ; Chia-Hung Yeh ; Chia-Yen Chen

Author_Institution

Dept. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan

fYear

2014

fDate

7-10 Oct. 2014

Firstpage

65

Lastpage

66

Abstract

In this paper, a light-weight 3D object reconstruction system is proposed. It aims to fulfill the increasing demand for fast and reliable 3D reconstruction in a mobile environment. Thereby, people can directly use their own device (e.g. mobile phone or tablet) to reconstruct desired objects into 3D models. The system is implemented and tested on an embedded board, MIO-5250, that is equipped with the recent Intel Atom N2600 series. With massive development of 3D technology, we believe the application proposed in this work would have rapidly expanding usages in the near future.

Keywords

embedded systems; image reconstruction; mobile computing; 3D object automated reconstruction; 3D technology; Intel Atom N2600 series; MIO-5250; embedded board; embedded system; light-weight 3D object reconstruction system; mobile apps; mobile environment; Cameras; Image reconstruction; Mobile communication; Real-time systems; Servers; Solid modeling; Three-dimensional displays; 3D reconstruction; Structure from Motion (SfM); embedded board;

fLanguage

English

Publisher

ieee

Conference_Titel

Consumer Electronics (GCCE), 2014 IEEE 3rd Global Conference on

Conference_Location

Tokyo

Type

conf

DOI

10.1109/GCCE.2014.7031340

Filename

7031340