Title :
Buried field rings - a novel edge termination method for 4H-SiC high voltage devices
Author :
Mihaila, A. ; Udrea, F. ; Godignon, P. ; Trajkovic, T. ; Brezeanu, G. ; Rusu, A. ; Rebollo, J. ; Millan, J.
Author_Institution :
Dept. of Eng., Cambridge Univ., UK
Abstract :
This paper is concerned with a numerical study of a novel edge breakdown termination technique for 4H-SiC high voltage devices. Buried field rings (BFRs) are proposed to be used, for the first time, in SiC devices as an effective termination method and the concept is numerically demonstrated for 4H-SiC MESA JFET structures. By using 4 BFRs for a MESA JFET, a breakdown voltage of 1,590 V has been achieved, representing more than 90% of the ideal bulk breakdown value (1,750 V). The influence of the buried rings doping on the blocking mode behaviour and the effect of the SiC/SiO2 interface charge on the breakdown voltage are studied. It is evidenced that the BFR termination offers a very stable blocking mode behaviour and the influence of processing conditions on its over-all performance is negligible. For comparison, some results for guard rings and junction termination extension are also presented.
Keywords :
doping profiles; interface states; junction gate field effect transistors; power field effect transistors; semiconductor device breakdown; semiconductor device models; silicon compounds; wide band gap semiconductors; 1590 V; 1750 V; 4H-SiC high voltage devices; BFR termination; JFET breakdown voltage; MESA JFET structures; SiC-SiO2; SiC/SiO2 interface charge; blocking mode behaviour buried rings doping effects; blocking mode stability; buried field ring edge termination method; guard rings; ideal bulk breakdown value; junction termination extension; Breakdown voltage; Conductivity; Doping; Electric breakdown; Frequency; Medical simulation; Silicon carbide; Stability; Temperature; Termination of employment;
Conference_Titel :
Semiconductor Conference, 2002. CAS 2002 Proceedings. International
Print_ISBN :
0-7803-7440-1
DOI :
10.1109/SMICND.2002.1105841