DocumentCode
2572050
Title
Precision passive alignment technologies for low cost array FTTH component
Author
Ericson, Thomas ; Palmskog, Göran ; Eriksen, Paul ; Lundström, Pontus ; Granberg, Mats ; Bäcklin, Lennart ; Fröjd, Kister ; Vieider, Christian
Author_Institution
ACREO AB, Kista, Sweden
fYear
2000
fDate
2000
Firstpage
115
Lastpage
116
Abstract
A combination of microstructure technologies for silicon and polymers has been used to fabricate BCB waveguide FTTH array components with a MT interface. Passive alignment structures have been used for both the laser array and the optical interface
Keywords
encapsulation; flip-chip devices; micro-optics; micromachining; optical communication equipment; optical couplers; optical fabrication; optical fibre subscriber loops; optical planar waveguides; plastic packaging; semiconductor laser arrays; BCB waveguide; LD arrays; MT interface; flip chip mounting; laser carrier; low cost array FTTH component; micromachining; microstructure technology; optical interface; planar waveguides; plastic encapsulation; polymer carrier; precision passive alignment technologies; Costs; Laser modes; Optical arrays; Optical fiber subscriber loops; Optical waveguides; Polymers; Semiconductor laser arrays; Silicon; Vertical cavity surface emitting lasers; Waveguide lasers;
fLanguage
English
Publisher
ieee
Conference_Titel
Optical MEMS, 2000 IEEE/LEOS International Conference on
Conference_Location
Kauai, HI
Print_ISBN
0-7803-6257-8
Type
conf
DOI
10.1109/OMEMS.2000.879653
Filename
879653
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