DocumentCode
2572120
Title
Thermal time response of microfilaments
Author
Supino, Ryan N. ; Talghader, Joseph J.
Author_Institution
Dept. of Electr. & Comput. Eng., Minnesota Univ., Minneapolis, MN, USA
fYear
2000
fDate
2000
Firstpage
123
Lastpage
124
Abstract
The thermal time response of polysilicon microfilaments has been characterized at high and room temperatures. We have found cool down time constants that are several times lower at room temperature than for equivalent filaments at high temperatures. It is proposed that the cool down transient can be directly controlled by “substrate quenching,” where the polysilicon filament is deflected into direct contact with the substrate. This could result in thermal responses several orders of magnitude faster than conventional structures and may have significant applications for high-speed microbolometer arrays
Keywords
bolometers; elemental semiconductors; filament lamps; micro-optics; micromachining; optical fabrication; silicon; transient response; MUMPS process; Si; cooldown time constants; cooldown transient; high temperature; high-speed microbolometer arrays; incandescent transient response; polysilicon microfilaments; room temperature; substrate quenching; thermal time response; Bridge circuits; Heat transfer; Oscilloscopes; Silicon; Temperature control; Temperature distribution; Temperature measurement; Thermal conductivity; Time factors; Time measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Optical MEMS, 2000 IEEE/LEOS International Conference on
Conference_Location
Kauai, HI
Print_ISBN
0-7803-6257-8
Type
conf
DOI
10.1109/OMEMS.2000.879657
Filename
879657
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