DocumentCode :
2572709
Title :
1.8 million transistor CMOS ASIC fabricated in a SiGe BiCMOS technology
Author :
Johnson, R.A. ; Zierak, M.J. ; Outama, K.B. ; Bahn, T.C. ; Joseph, A.J. ; Cordero, C.N. ; Malinowski, J. ; Bard, K.A. ; Weeks, T.W. ; Milliken, R.A. ; Medve, T.J. ; May, G.A. ; Chong, W. ; Walter, K.M. ; Tempest, S.L. ; Chau, B.B. ; Boenke, Myra ; Nelson,
Author_Institution :
Microelectron. Div., IBM Corp., Essex Junction, VT, USA
fYear :
1998
fDate :
6-9 Dec. 1998
Firstpage :
217
Lastpage :
220
Abstract :
To investigate the potential of high level integration in SiGe BiCMOS, we have fabricated a 1.8 million transistor CMOS ASIC testsite (8.06 mm/spl times/8.06 mm) alongside various SiGe heterojunction bipolar transistor (HBT) circuits and yield monitor structures. The ASIC testsite was used to validate the ASIC library elements, perform hardware to model correlation, and for reliability, ESD, hot electron and thermal cycle stressing. We have verified that the incorporation of high-speed bipolar devices does not degrade the operation and reliability of VLSI CMOS circuits, resulting in an ideal BiCMOS process to fabricate a single-chip radio for wireless communications. This circuit represents the largest circuit ever built in a SiGe BiCMOS technology.
Keywords :
BiCMOS integrated circuits; Ge-Si alloys; VLSI; application specific integrated circuits; electrostatic discharge; hot carriers; integrated circuit reliability; integrated circuit testing; integrated circuit yield; mixed analogue-digital integrated circuits; semiconductor materials; ASIC testsite; BiCMOS technology; CMOS ASIC; ESD; SiGe; VLSI; hardware to model correlation; heterojunction bipolar transistor; high level integration; hot electron stressing; library elements; reliability; single-chip radio; thermal cycle stressing; yield monitor structures; Application specific integrated circuits; BiCMOS integrated circuits; Bipolar transistor circuits; Circuit testing; Germanium silicon alloys; Heterojunction bipolar transistors; Libraries; Monitoring; Performance evaluation; Silicon germanium;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1998. IEDM '98. Technical Digest., International
Conference_Location :
San Francisco, CA, USA
ISSN :
0163-1918
Print_ISBN :
0-7803-4774-9
Type :
conf
DOI :
10.1109/IEDM.1998.746330
Filename :
746330
Link To Document :
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