• DocumentCode
    2572709
  • Title

    1.8 million transistor CMOS ASIC fabricated in a SiGe BiCMOS technology

  • Author

    Johnson, R.A. ; Zierak, M.J. ; Outama, K.B. ; Bahn, T.C. ; Joseph, A.J. ; Cordero, C.N. ; Malinowski, J. ; Bard, K.A. ; Weeks, T.W. ; Milliken, R.A. ; Medve, T.J. ; May, G.A. ; Chong, W. ; Walter, K.M. ; Tempest, S.L. ; Chau, B.B. ; Boenke, Myra ; Nelson,

  • Author_Institution
    Microelectron. Div., IBM Corp., Essex Junction, VT, USA
  • fYear
    1998
  • fDate
    6-9 Dec. 1998
  • Firstpage
    217
  • Lastpage
    220
  • Abstract
    To investigate the potential of high level integration in SiGe BiCMOS, we have fabricated a 1.8 million transistor CMOS ASIC testsite (8.06 mm/spl times/8.06 mm) alongside various SiGe heterojunction bipolar transistor (HBT) circuits and yield monitor structures. The ASIC testsite was used to validate the ASIC library elements, perform hardware to model correlation, and for reliability, ESD, hot electron and thermal cycle stressing. We have verified that the incorporation of high-speed bipolar devices does not degrade the operation and reliability of VLSI CMOS circuits, resulting in an ideal BiCMOS process to fabricate a single-chip radio for wireless communications. This circuit represents the largest circuit ever built in a SiGe BiCMOS technology.
  • Keywords
    BiCMOS integrated circuits; Ge-Si alloys; VLSI; application specific integrated circuits; electrostatic discharge; hot carriers; integrated circuit reliability; integrated circuit testing; integrated circuit yield; mixed analogue-digital integrated circuits; semiconductor materials; ASIC testsite; BiCMOS technology; CMOS ASIC; ESD; SiGe; VLSI; hardware to model correlation; heterojunction bipolar transistor; high level integration; hot electron stressing; library elements; reliability; single-chip radio; thermal cycle stressing; yield monitor structures; Application specific integrated circuits; BiCMOS integrated circuits; Bipolar transistor circuits; Circuit testing; Germanium silicon alloys; Heterojunction bipolar transistors; Libraries; Monitoring; Performance evaluation; Silicon germanium;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1998. IEDM '98. Technical Digest., International
  • Conference_Location
    San Francisco, CA, USA
  • ISSN
    0163-1918
  • Print_ISBN
    0-7803-4774-9
  • Type

    conf

  • DOI
    10.1109/IEDM.1998.746330
  • Filename
    746330