DocumentCode
2572709
Title
1.8 million transistor CMOS ASIC fabricated in a SiGe BiCMOS technology
Author
Johnson, R.A. ; Zierak, M.J. ; Outama, K.B. ; Bahn, T.C. ; Joseph, A.J. ; Cordero, C.N. ; Malinowski, J. ; Bard, K.A. ; Weeks, T.W. ; Milliken, R.A. ; Medve, T.J. ; May, G.A. ; Chong, W. ; Walter, K.M. ; Tempest, S.L. ; Chau, B.B. ; Boenke, Myra ; Nelson,
Author_Institution
Microelectron. Div., IBM Corp., Essex Junction, VT, USA
fYear
1998
fDate
6-9 Dec. 1998
Firstpage
217
Lastpage
220
Abstract
To investigate the potential of high level integration in SiGe BiCMOS, we have fabricated a 1.8 million transistor CMOS ASIC testsite (8.06 mm/spl times/8.06 mm) alongside various SiGe heterojunction bipolar transistor (HBT) circuits and yield monitor structures. The ASIC testsite was used to validate the ASIC library elements, perform hardware to model correlation, and for reliability, ESD, hot electron and thermal cycle stressing. We have verified that the incorporation of high-speed bipolar devices does not degrade the operation and reliability of VLSI CMOS circuits, resulting in an ideal BiCMOS process to fabricate a single-chip radio for wireless communications. This circuit represents the largest circuit ever built in a SiGe BiCMOS technology.
Keywords
BiCMOS integrated circuits; Ge-Si alloys; VLSI; application specific integrated circuits; electrostatic discharge; hot carriers; integrated circuit reliability; integrated circuit testing; integrated circuit yield; mixed analogue-digital integrated circuits; semiconductor materials; ASIC testsite; BiCMOS technology; CMOS ASIC; ESD; SiGe; VLSI; hardware to model correlation; heterojunction bipolar transistor; high level integration; hot electron stressing; library elements; reliability; single-chip radio; thermal cycle stressing; yield monitor structures; Application specific integrated circuits; BiCMOS integrated circuits; Bipolar transistor circuits; Circuit testing; Germanium silicon alloys; Heterojunction bipolar transistors; Libraries; Monitoring; Performance evaluation; Silicon germanium;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1998. IEDM '98. Technical Digest., International
Conference_Location
San Francisco, CA, USA
ISSN
0163-1918
Print_ISBN
0-7803-4774-9
Type
conf
DOI
10.1109/IEDM.1998.746330
Filename
746330
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