DocumentCode :
2572991
Title :
Within-chip variability analysis
Author :
Nassif, S.R.
Author_Institution :
Res. Lab., IBM Corp., Austin, TX, USA
fYear :
1998
fDate :
6-9 Dec. 1998
Firstpage :
283
Lastpage :
286
Abstract :
Current, integrated circuits are large enough that device and interconnect parameter variations within it chip are as important as those same variations from chip to chip. Previously, digital designers were concerned only with chip-to-chip variability, for which analysis techniques exist; concern for within-chip variations has been in the domain of analog circuit design. In this paper, we lay the groundwork needed to analyze the impact of inter-chip variations on digital circuits and propose an extreme-case analysis algorithm to efficiently determine the worst case performance due to such variability.
Keywords :
digital integrated circuits; integrated circuit design; device parameters; digital integrated circuit design; extreme-case analysis algorithm; interconnect parameters; within-chip variability analysis; Circuit simulation; Hip; Integrated circuit interconnections; Power grids; Radio access networks; Semiconductor device modeling; Temperature; Tiles; Tin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1998. IEDM '98. Technical Digest., International
Conference_Location :
San Francisco, CA, USA
ISSN :
0163-1918
Print_ISBN :
0-7803-4774-9
Type :
conf
DOI :
10.1109/IEDM.1998.746355
Filename :
746355
Link To Document :
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