Title :
A fast 3D modeling approach to parasitics extraction of bonding wires for RF circuits
Author :
Xiaoning Qi ; Yue, C.P. ; Amborg, T. ; Soh, H.T. ; Zhiping Yu ; Dutton, R.W. ; Sakai, H.
Author_Institution :
Center for Integrated Syst., Stanford Univ., CA, USA
Abstract :
An approach to fast 3D modeling of the geometry for bonding wires in RF circuits and packages is demonstrated. The geometry can readily be used to extract electrical parameters such as inductance and capacitance. An equivalent circuit is presented to model the frequency response of bonding wires. To verify simulation accuracy, test structures have been designed and measured. Excellent agreement between simulated and measured data is demonstrated up to 10 GHz.
Keywords :
VLSI; capacitance; circuit simulation; equivalent circuits; frequency response; inductance; integrated circuit design; integrated circuit modelling; integrated circuit packaging; lead bonding; 0 to 10 GHz; 3D modeling approach; RF circuits; bonding wires; capacitance; electrical parameters; equivalent circuit; frequency response; inductance; parasitics extraction; simulation accuracy; test structures; Bonding; Circuit simulation; Data mining; Geometry; Inductance; Packaging; Parasitic capacitance; Radio frequency; Solid modeling; Wires;
Conference_Titel :
Electron Devices Meeting, 1998. IEDM '98. Technical Digest., International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-4774-9
DOI :
10.1109/IEDM.1998.746359
