Title :
Suppression of Nickel Out-Diffusion from Porous Nickel-Titanium Shape Memory Alloy by Plasma Immersion Ion Implantation
Author :
Ho, Joan P Y ; Wu, S.L. ; Poon, Ray W Y ; Liu, X.Y. ; Chung, C.Y. ; Chu, Paul K. ; Yeung, Kelvin W.K. ; Lu, William W. ; Cheung, Kenneth M C
Author_Institution :
Dept. of Phys. & Mater. Sci., City Univ. of Hong Kong, Kowloon
Abstract :
Summary form only given. Porous nickel titanium is a promising material for medical application not only because of its super elasticity and shape memory effect but also the porous structure which may enhance bone growth due to the increased surface area. It is thus especially suitable for bone tissue in-growth and fixation of biomedical implants. However, like its dense counterpart, Ni leaching from the materials causes health concern. Thus, in order to suppress Ni diffusion from the materials to body fluids and tissues in humans, a diffusion barrier or similar structure must be introduced. In this work, we produced this diffusion barrier layer by oxygen or nitrogen plasma immersion ion implantation (PIII). In vitro tests were conducted by immersing the plasma-treated NiTi into simulated body fluid (SBF) at 37plusmn0.5degC for 5 weeks and the resulting SBF was analyzed for Ni and Ti using inductively-coupled plasma mass spectrometry (ICMPS). Our results show that Ni leaching is significantly mitigated by both nitrogen and oxygen PIII.
Keywords :
biomedical materials; bone; diffusion barriers; elasticity; mass spectroscopy; nickel alloys; plasma immersion ion implantation; porosity; porous materials; prosthetics; shape memory effects; titanium alloys; 37 degC; 5 week; NiTi; biomedical implant fixation; bone tissue in-growth; diffusion barrier; inductively-coupled plasma mass spectrometry; medical application; nickel out-diffusion; plasma immersion ion implantation; porous nickel-titanium shape memory alloy; simulated body fluid; superelasticity; Biological materials; Biomedical materials; Leaching; Medical services; Nickel; Nitrogen; Plasma immersion ion implantation; Plasma simulation; Shape memory alloys; Titanium;
Conference_Titel :
Plasma Science, 2005. ICOPS '05. IEEE Conference Record - Abstracts. IEEE International Conference on
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-9300-7
DOI :
10.1109/PLASMA.2005.359457