• DocumentCode
    257330
  • Title

    Analysis of Electrical Responses of MEMS Piezoresistive Microcantilever

  • Author

    Ab Rahim, Rosminazuin ; Abubakkar, Sheik Fareed Ookar ; Bais, Badariah ; Majlis, Burhanuddin Yeop

  • Author_Institution
    Fac. of Eng., Int. Islamic Univ. Malaysia, Kuala Lumpur, Malaysia
  • fYear
    2014
  • fDate
    23-25 Sept. 2014
  • Firstpage
    123
  • Lastpage
    126
  • Abstract
    In this paper, an optimization of mechanical and electrical performance of single-layer silicon piezoresistive microcantilever (PRM) sensor in which both piezoresistor and microcantilever structures are made of the same material of single-crystalline silicon was discussed. Using CoventorWare 2008, the mechanical and electrical behaviors of the PRM structure was investigated by studying few contributing factors that affect the performance of the device. The performance of PRM sensor was investigated by observing the effects of applied loads to the current change and sensitivity of the device. Apart from that, the effects of thermal noise to the device´s performance were also investigated. From the simulation results, at applied loads between 1 to 10 μN, significant current increase of about 0.094% was observed. This current increase can be translated into an increase of sensitivity in the device. Simulation results also revealed that at temperature change between 290 K to 300 K, the PRM sensor shows insignificant change to sensitivity.
  • Keywords
    cantilevers; elemental semiconductors; microsensors; piezoresistive devices; resistors; silicon; thermal noise; CoventorWare 2008; MEMS piezoresistive microcantilever; Si; electrical responses; microcantilever structures; optimization; piezoresistor structure; single-crystalline silicon; single-layer silicon PRM sensor; temperature 290 K to 300 K; thermal noise; Abstracts; Computational modeling; Computers; Load modeling; Micromechanical devices; Sensitivity; Thermal loading; Coventor Ware 2008; MEMS; microcantilever; piezoresistor;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer and Communication Engineering (ICCCE), 2014 International Conference on
  • Conference_Location
    Kuala Lumpur
  • Type

    conf

  • DOI
    10.1109/ICCCE.2014.45
  • Filename
    7031616