• DocumentCode
    2573665
  • Title

    A new methodology for dynamic reconfiguration of structured ASIC

  • Author

    Tulbure, Traian

  • Author_Institution
    Dept. of Electron. & Comput., Transilvania Univ., Brasov, Romania
  • fYear
    2012
  • fDate
    25-28 Oct. 2012
  • Firstpage
    299
  • Lastpage
    302
  • Abstract
    This paper presents the methodology and EDA software for dynamic reconfiguration of structured ASIC technology. New dynamic reconfigurable architectures introduced for structured ASIC offer a solution to use both temporal and spatial capacity of logic devices. The proposed solution reuses stages of standard implementation flow for structured ASIC and adds custom EDA software for programming and reconfiguration. The methodology is separated in two stages: pre-fabrication and post-fabrication. While the pre-fabrication stage uses the standard flow of implementing structured ASIC circuits the post fabrication programming is a new stage build around custom EDA software. This stage uses a behavioral Verilog description of the circuit to generate a memory image that can be loaded into the structured ASIC in order to change the circuit logic function. Device functionality can be modified at each power-up cycle by loading the memory image from external memory or during application execution to allow rapid dynamic logic reconfiguration.
  • Keywords
    application specific integrated circuits; electronic design automation; logic circuits; logic design; reconfigurable architectures; EDA software; behavioral Verilog description; circuit logic function; device functionality; dynamic reconfigurable architectures; logic devices; memory image; post fabrication programming; post-fabrication stage; power-up cycle; prefabrication stage; structured ASIC circuits; structured ASIC dynamic reconfiguration technology; Application specific integrated circuits; Context; Multiplexing; Reconfigurable architectures; Software; Timing; EDA; PLA; Reconfigurable hardware; Verilog; structured ASIC;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design and Technology in Electronic Packaging (SIITME), 2012 IEEE 18th International Symposium for
  • Conference_Location
    Alba Iulia
  • Print_ISBN
    978-1-4673-4760-0
  • Electronic_ISBN
    INAVLID ISBN
  • Type

    conf

  • DOI
    10.1109/SIITME.2012.6384396
  • Filename
    6384396