DocumentCode
2573673
Title
Monolithic arrays of micromachined pixels for infrared applications
Author
Cole, B.E. ; Higashi, R.E. ; Wood, R.A.
Author_Institution
Honeywell Technol. Center, Plymouth, MN, USA
fYear
1998
fDate
6-9 Dec. 1998
Firstpage
459
Lastpage
462
Abstract
Small micromachined structures (typically 10/sup -5/ cm/sup 2/) have been fabricated with very small thermal mass (C) of about 10/sup -9/ J/K, which are suspended from the underlying silicon substrate by supports of such delicacy that the structures are extremely well thermally isolated from the substrate having a thermal conductance to the substrate of about 10/sup -7/ W/K. This thermal conductance (G) is close to the smallest value possible, about 10/sup -8/ W/K, due to radiative energy exchange. This high thermal isolation allows the microstructure temperature to be readily controlled by very small heating currents, or very small amounts of infrared (IR) incident flux. Large arrays of such microstructures have been fabricated on silicon wafers, with complex integrated electronic circuits, and operated as (1) sensitive room-temperature IR sensors ("microbolometers") and (2) large arrays of individually controllable IR microemitters.
Keywords
bolometers; infrared detectors; infrared sources; micromachining; microsensors; optical arrays; IR microemitter; Si; infrared sensor; integrated electronic circuit; microbolometer; micromachined pixels; microstructure fabrication; monolithic array; radiative energy exchange; silicon wafer substrate; thermal conductance; thermal isolation; thermal mass; Electronic circuits; Energy exchange; Infrared heating; Infrared sensors; Microstructure; Sensor arrays; Silicon; Temperature control; Temperature sensors; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1998. IEDM '98. Technical Digest., International
Conference_Location
San Francisco, CA, USA
ISSN
0163-1918
Print_ISBN
0-7803-4774-9
Type
conf
DOI
10.1109/IEDM.1998.746397
Filename
746397
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