• DocumentCode
    2573673
  • Title

    Monolithic arrays of micromachined pixels for infrared applications

  • Author

    Cole, B.E. ; Higashi, R.E. ; Wood, R.A.

  • Author_Institution
    Honeywell Technol. Center, Plymouth, MN, USA
  • fYear
    1998
  • fDate
    6-9 Dec. 1998
  • Firstpage
    459
  • Lastpage
    462
  • Abstract
    Small micromachined structures (typically 10/sup -5/ cm/sup 2/) have been fabricated with very small thermal mass (C) of about 10/sup -9/ J/K, which are suspended from the underlying silicon substrate by supports of such delicacy that the structures are extremely well thermally isolated from the substrate having a thermal conductance to the substrate of about 10/sup -7/ W/K. This thermal conductance (G) is close to the smallest value possible, about 10/sup -8/ W/K, due to radiative energy exchange. This high thermal isolation allows the microstructure temperature to be readily controlled by very small heating currents, or very small amounts of infrared (IR) incident flux. Large arrays of such microstructures have been fabricated on silicon wafers, with complex integrated electronic circuits, and operated as (1) sensitive room-temperature IR sensors ("microbolometers") and (2) large arrays of individually controllable IR microemitters.
  • Keywords
    bolometers; infrared detectors; infrared sources; micromachining; microsensors; optical arrays; IR microemitter; Si; infrared sensor; integrated electronic circuit; microbolometer; micromachined pixels; microstructure fabrication; monolithic array; radiative energy exchange; silicon wafer substrate; thermal conductance; thermal isolation; thermal mass; Electronic circuits; Energy exchange; Infrared heating; Infrared sensors; Microstructure; Sensor arrays; Silicon; Temperature control; Temperature sensors; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1998. IEDM '98. Technical Digest., International
  • Conference_Location
    San Francisco, CA, USA
  • ISSN
    0163-1918
  • Print_ISBN
    0-7803-4774-9
  • Type

    conf

  • DOI
    10.1109/IEDM.1998.746397
  • Filename
    746397