Title :
Investigation of the oxidation process at the copper-solder interface with atomic force microscopy
Author :
Bonyár, Attila ; Hurtony, Tamás ; Dávid, Szabolcs
Author_Institution :
Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Budapest, Hungary
Abstract :
In this work the investigation of copper-solder interface with Atomic Force Microscope (AFM) is presented. Multiple contact and tapping-mode AFM images were made on presoldered cross-sectional SAC (Sn-Ag-Cu) solder joint samples. The formation of oxide layer was observed and the structural properties of oxide were monitored in time. Our aim was to determine the maximum idle time between the sample preparation and the further analysis, based on only the monitored corrosion profile of the copper-solder interface.
Keywords :
atomic force microscopy; copper; corrosion; gold alloys; oxidation; silver alloys; solders; tin alloys; Sn-Ag-Cu; atomic force microscopy; copper-solder interface; corrosion profile; multiple contact; oxidation process; structural properties; tapping-mode AFM image; Atomic force microscopy; Copper; Corrosion; Oxidation; Surface treatment; Tin; Atomic Force Microscope (AFM); corrosion; intermetallic compounds;
Conference_Titel :
Design and Technology in Electronic Packaging (SIITME), 2012 IEEE 18th International Symposium for
Conference_Location :
Alba Iulia
Print_ISBN :
978-1-4673-4760-0
Electronic_ISBN :
INAVLID ISBN
DOI :
10.1109/SIITME.2012.6384400
