DocumentCode
2573839
Title
Foreword
fYear
2012
fDate
25-28 Oct. 2012
Firstpage
1
Lastpage
3
Abstract
SIITME has established itself as a reference event on the topic of Electronic Packaging for the Central and Eastern Europe. For this maturity edition, the location of SIITME is the historical city of Alba-Iulia. This event, taking place each fall, has become a wonderful occasion for young researchers to present their active research and become acquainted with the challenges of defending their work in front of professionals from their area of expertise. Efforts are made to facilitate their participation, in order to raise their confidence in presenting their results. Both oral and poster presentations will take place and these should offer the possibility for participants, be them young scientists, professors or members of industry, to have a fruitful exchange of ideas.
fLanguage
English
Publisher
ieee
Conference_Titel
Design and Technology in Electronic Packaging (SIITME), 2012 IEEE 18th International Symposium for
Conference_Location
Alba Iulia, Romania
Print_ISBN
978-1-4673-4760-0
Electronic_ISBN
INAVLID ISBN
Type
conf
DOI
10.1109/SIITME.2012.6384408
Filename
6384408
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