Title :
Table of contents
Abstract :
The following topics are dealt with: emerging technologies and trends in advanced packaging; power electronics and microsystems packaging; assembly and manufacturing technology; electrical design, simulation and modeling; optoelectronics and advanced communication packaging;applied reliability; and challenges in global education.
Keywords :
circuit reliability; circuit simulation; electronics industry; electronics packaging; engineering education; microassembling; network synthesis; optoelectronic devices; telecommunication equipment; advanced communication packaging; advanced packaging; applied reliability; assembly technology; electrical design; electrical modeling; electrical simulation; global education; manufacturing technology; microsystems packaging; optoelectronics packaging; power electronics packaging;
Conference_Titel :
Design and Technology in Electronic Packaging (SIITME), 2012 IEEE 18th International Symposium for
Conference_Location :
Alba Iulia
Print_ISBN :
978-1-4673-4760-0
Electronic_ISBN :
INAVLID ISBN
DOI :
10.1109/SIITME.2012.6384409
