• DocumentCode
    2573925
  • Title

    New analytic models and efficient parameter extraction for computationally efficient 1-D and 2-D ion implantation modeling

  • Author

    Balamurugan, G. ; Obradovic, B. ; Wang, G. ; Chen, Y. ; Tasch, A.

  • Author_Institution
    Microelectron. Res. Center, Texas Univ., Austin, TX, USA
  • fYear
    1998
  • fDate
    6-9 Dec. 1998
  • Firstpage
    517
  • Lastpage
    520
  • Abstract
    The rapid progress of CMOS process technology has led to increased process complexity and fabrication cost and has created a strong need for accurate and computationally efficient ion implantation models. In this paper, we propose new and improved analytic models for as-implanted impurity and damage profiles in one and two dimensions. The development of models for the as-implanted damage profile is becoming increasingly important, since it is well known that the implant-induced damage has a significant impact on the diffusion of impurities during subsequent thermal treatment, especially under minimal thermal budget conditions. A new approach to 2-D analytic ion implant simulation that takes into account implant-induced damage, and generates 2-D interstitial/vacancy profiles in addition to impurity profiles, is also described. Finally, a methodology is discussed for automating the extraction of model parameters for generating lookup tables.
  • Keywords
    doping profiles; interstitials; ion implantation; semiconductor process modelling; vacancies (crystal); 1D model; 2D model; CMOS process technology; analytic model; computational efficiency; damage profile; impurity diffusion; impurity profile; interstitial; ion implantation; lookup table; parameter extraction; thermal treatment; vacancy; Analytical models; CMOS process; CMOS technology; Costs; Fabrication; Implants; Impurities; Ion implantation; Parameter extraction; Semiconductor device modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1998. IEDM '98. Technical Digest., International
  • Conference_Location
    San Francisco, CA, USA
  • ISSN
    0163-1918
  • Print_ISBN
    0-7803-4774-9
  • Type

    conf

  • DOI
    10.1109/IEDM.1998.746411
  • Filename
    746411