DocumentCode :
2573925
Title :
New analytic models and efficient parameter extraction for computationally efficient 1-D and 2-D ion implantation modeling
Author :
Balamurugan, G. ; Obradovic, B. ; Wang, G. ; Chen, Y. ; Tasch, A.
Author_Institution :
Microelectron. Res. Center, Texas Univ., Austin, TX, USA
fYear :
1998
fDate :
6-9 Dec. 1998
Firstpage :
517
Lastpage :
520
Abstract :
The rapid progress of CMOS process technology has led to increased process complexity and fabrication cost and has created a strong need for accurate and computationally efficient ion implantation models. In this paper, we propose new and improved analytic models for as-implanted impurity and damage profiles in one and two dimensions. The development of models for the as-implanted damage profile is becoming increasingly important, since it is well known that the implant-induced damage has a significant impact on the diffusion of impurities during subsequent thermal treatment, especially under minimal thermal budget conditions. A new approach to 2-D analytic ion implant simulation that takes into account implant-induced damage, and generates 2-D interstitial/vacancy profiles in addition to impurity profiles, is also described. Finally, a methodology is discussed for automating the extraction of model parameters for generating lookup tables.
Keywords :
doping profiles; interstitials; ion implantation; semiconductor process modelling; vacancies (crystal); 1D model; 2D model; CMOS process technology; analytic model; computational efficiency; damage profile; impurity diffusion; impurity profile; interstitial; ion implantation; lookup table; parameter extraction; thermal treatment; vacancy; Analytical models; CMOS process; CMOS technology; Costs; Fabrication; Implants; Impurities; Ion implantation; Parameter extraction; Semiconductor device modeling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1998. IEDM '98. Technical Digest., International
Conference_Location :
San Francisco, CA, USA
ISSN :
0163-1918
Print_ISBN :
0-7803-4774-9
Type :
conf
DOI :
10.1109/IEDM.1998.746411
Filename :
746411
Link To Document :
بازگشت