Reliability evaluation on deterioration of power device using coupled electrical-thermal-mechanical analysis

Author

Anzawa, Takashi ; Yu, Qiang ; Yamagiwa, Masanori ; Shibutani, Tadahiro ; Shiratori, Masaki

Author_Institution

Dept. of Mech. Eng. & Mater. Sci., Yokohama Nat. Univ., Yokohama, Japan

fYear

2008

fDate

17-20 Dec. 2008

Firstpage

319

Lastpage

324

Abstract

This paper presents a fundamental method to evaluate thermal fatigue life of power module. Coupled electrical-thermal analysis was performed to obtain the distribution of temperature due to electric current. Then, thermo-mechanical analysis was carried out to calculate inelastic strain range generated in a solder joint. Crack path simulation technique was used to evaluate total fatigue life and rise in temperature. Fatigue crack initiates under Al bonding wire for the IGBT module. Crack propagation induces the change in thermal properties of power devices. Total fatigue life changes with configuration of model.

Keywords

fatigue cracks; power system reliability; thermal analysis; thermal stress cracking; IGBT module; bonding wire; coupled electrical-thermal-mechanical analysis; crack path simulation; crack propagation; electric current; fatigue crack; inelastic strain range; power device deterioration; power module; reliability evaluation; solder joint; temperature distribution; thermal fatigue life; thermo-mechanical analysis; Bonding; Capacitive sensors; Couplings; Current; Fatigue; Multichip modules; Performance analysis; Soldering; Temperature distribution; Thermomechanical processes;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal Issues in Emerging Technologies, 2008. ThETA '08. Second International Conference on

Conference_Location

Cairo

Print_ISBN

978-1-4244-3576-0

Electronic_ISBN

978-1-4244-3577-7

Type

conf

DOI

10.1109/THETA.2008.5167181

Filename

5167181