DocumentCode :
2574774
Title :
An integrated approach for accurate simulation and modeling of the silicide-source/drain structure and the silicide-diffusion contact resistance
Author :
Apte, P.P. ; Potla, S. ; Prinslow, D.A. ; Pollack, G. ; Scott, D. ; Varahramyan, K.
Author_Institution :
Texas Instrum. Inc., Dallas, TX, USA
fYear :
1998
fDate :
6-9 Dec. 1998
Firstpage :
729
Lastpage :
732
Abstract :
We present the first integrated simulation and modeling approach for the silicide-source/drain structure, and for the silicide-diffusion contact resistance; thus, providing the critical link between electrical performance and the processing/structural variables forming the silicide source/drain region. We apply this approach to predict the silicide-diffusion contact resistance accurately, and to improve transistor performance significantly.
Keywords :
contact resistance; diffusion; metallisation; semiconductor process modelling; MOS transistor; model; silicide diffusion contact resistance; silicide source/drain structure; simulation; Calibration; Contact resistance; Electric variables measurement; MOSFETs; Semiconductor device modeling; Silicides; Thickness measurement; Threshold voltage; Tin; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1998. IEDM '98. Technical Digest., International
Conference_Location :
San Francisco, CA, USA
ISSN :
0163-1918
Print_ISBN :
0-7803-4774-9
Type :
conf
DOI :
10.1109/IEDM.1998.746460
Filename :
746460
Link To Document :
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