• DocumentCode
    2574774
  • Title

    An integrated approach for accurate simulation and modeling of the silicide-source/drain structure and the silicide-diffusion contact resistance

  • Author

    Apte, P.P. ; Potla, S. ; Prinslow, D.A. ; Pollack, G. ; Scott, D. ; Varahramyan, K.

  • Author_Institution
    Texas Instrum. Inc., Dallas, TX, USA
  • fYear
    1998
  • fDate
    6-9 Dec. 1998
  • Firstpage
    729
  • Lastpage
    732
  • Abstract
    We present the first integrated simulation and modeling approach for the silicide-source/drain structure, and for the silicide-diffusion contact resistance; thus, providing the critical link between electrical performance and the processing/structural variables forming the silicide source/drain region. We apply this approach to predict the silicide-diffusion contact resistance accurately, and to improve transistor performance significantly.
  • Keywords
    contact resistance; diffusion; metallisation; semiconductor process modelling; MOS transistor; model; silicide diffusion contact resistance; silicide source/drain structure; simulation; Calibration; Contact resistance; Electric variables measurement; MOSFETs; Semiconductor device modeling; Silicides; Thickness measurement; Threshold voltage; Tin; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1998. IEDM '98. Technical Digest., International
  • Conference_Location
    San Francisco, CA, USA
  • ISSN
    0163-1918
  • Print_ISBN
    0-7803-4774-9
  • Type

    conf

  • DOI
    10.1109/IEDM.1998.746460
  • Filename
    746460