DocumentCode
2574774
Title
An integrated approach for accurate simulation and modeling of the silicide-source/drain structure and the silicide-diffusion contact resistance
Author
Apte, P.P. ; Potla, S. ; Prinslow, D.A. ; Pollack, G. ; Scott, D. ; Varahramyan, K.
Author_Institution
Texas Instrum. Inc., Dallas, TX, USA
fYear
1998
fDate
6-9 Dec. 1998
Firstpage
729
Lastpage
732
Abstract
We present the first integrated simulation and modeling approach for the silicide-source/drain structure, and for the silicide-diffusion contact resistance; thus, providing the critical link between electrical performance and the processing/structural variables forming the silicide source/drain region. We apply this approach to predict the silicide-diffusion contact resistance accurately, and to improve transistor performance significantly.
Keywords
contact resistance; diffusion; metallisation; semiconductor process modelling; MOS transistor; model; silicide diffusion contact resistance; silicide source/drain structure; simulation; Calibration; Contact resistance; Electric variables measurement; MOSFETs; Semiconductor device modeling; Silicides; Thickness measurement; Threshold voltage; Tin; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1998. IEDM '98. Technical Digest., International
Conference_Location
San Francisco, CA, USA
ISSN
0163-1918
Print_ISBN
0-7803-4774-9
Type
conf
DOI
10.1109/IEDM.1998.746460
Filename
746460
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