Title : 
An integrated approach for accurate simulation and modeling of the silicide-source/drain structure and the silicide-diffusion contact resistance
         
        
            Author : 
Apte, P.P. ; Potla, S. ; Prinslow, D.A. ; Pollack, G. ; Scott, D. ; Varahramyan, K.
         
        
            Author_Institution : 
Texas Instrum. Inc., Dallas, TX, USA
         
        
        
        
        
        
            Abstract : 
We present the first integrated simulation and modeling approach for the silicide-source/drain structure, and for the silicide-diffusion contact resistance; thus, providing the critical link between electrical performance and the processing/structural variables forming the silicide source/drain region. We apply this approach to predict the silicide-diffusion contact resistance accurately, and to improve transistor performance significantly.
         
        
            Keywords : 
contact resistance; diffusion; metallisation; semiconductor process modelling; MOS transistor; model; silicide diffusion contact resistance; silicide source/drain structure; simulation; Calibration; Contact resistance; Electric variables measurement; MOSFETs; Semiconductor device modeling; Silicides; Thickness measurement; Threshold voltage; Tin; Transistors;
         
        
        
        
            Conference_Titel : 
Electron Devices Meeting, 1998. IEDM '98. Technical Digest., International
         
        
            Conference_Location : 
San Francisco, CA, USA
         
        
        
            Print_ISBN : 
0-7803-4774-9
         
        
        
            DOI : 
10.1109/IEDM.1998.746460