DocumentCode :
2574898
Title :
A heuristic approach for scheduling multi-chip packages for semiconductor backend assembly
Author :
Chua, T.J. ; Cai, T.X. ; Yin, X.F.
Author_Institution :
Singapore Inst. of Manuf. Technol., Singapore
fYear :
2007
fDate :
25-28 Sept. 2007
Firstpage :
1024
Lastpage :
1030
Abstract :
The processes in which the multi-chip packages (MCP) positions the multiple dies to one lead frame pose great challenges to production scheduling in the semiconductor backend assembly environment. A MCP scheduling problem is also called the multi-pass scheduling problem, as multiple passes are carried out on the same operation sequentially. Such a scheduling problem does not belong to any of the conventional scheduling categories and its constraints are much more complex to tackle. This paper describes a practical realization of a heuristics approach for scheduling MCP problem. The enhanced daily production scheduling (DPS) engine is capable of modeling the real production constraints, resulting in a more realistic and practical schedule which can be followed closely by the production supervisors, eliminating the ad-hoc and error-prone manual practices.
Keywords :
assembling; multichip modules; scheduling; semiconductor device manufacture; semiconductor device packaging; daily production scheduling; heuristic approach; multichip packages scheduling; multipass scheduling problem; semiconductor backend assembly; Assembly; Cost function; Energy consumption; Job shop scheduling; Manufacturing processes; Product design; Production systems; Semiconductor device packaging; Single machine scheduling; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Emerging Technologies and Factory Automation, 2007. ETFA. IEEE Conference on
Conference_Location :
Patras
Print_ISBN :
978-1-4244-0825-2
Electronic_ISBN :
978-1-4244-0826-9
Type :
conf
DOI :
10.1109/EFTA.2007.4416896
Filename :
4416896
Link To Document :
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