• DocumentCode
    2575498
  • Title

    Filler Contents Effects on the Moisture Absorption and Viscoelasticity of Thermosetting IC Packaging Polymers

  • Author

    Ma, Xiaosong ; Jansen, K.M.B. ; Zhang, G.Q. ; Ernst, L.J.

  • Author_Institution
    Delft Univ. of Technol.
  • fYear
    2006
  • fDate
    26-29 Aug. 2006
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Four types of polymer which were selected are EPN1180 and EPN1180 filled with, 40%, 50%, and 65% fused silica. The moisture absorption is carried out in an adjustable thermal and humidity chamber at different temperature and humidity. The diffusion coefficients at different conditions were obtained through the early stage moisture absorption tests. The moisture absorption was revealed to show the Fickian type of diffusion for four types of samples. In addition the most important issue, the relation between moisture content and filler content is discussed and is revealed. Using this relation, the authors can expect moisture content in the sample with different moisture contents under different temperature and relative humidity conditions. Another issue, the relation between the viscoelasticity and filler content, is revealed. The authors find that the filler has a great effect on the viscoelasticity. The storage modulus is increased 30% by adding 65wt% fused silica
  • Keywords
    filler metals; humidity; integrated circuit packaging; polymers; viscoelasticity; EPN1180; Fickian type; filler contents effects; fused silica; integrated circuit packaging polymers; moisture absorption; relative humidity conditions; storage modulus; thermosetting; viscoelasticity; Absorption; Elasticity; Humidity; Integrated circuit packaging; Moisture; Polymers; Silicon compounds; Temperature; Testing; Viscosity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    1-4244-0619-6
  • Electronic_ISBN
    1-4244-0620-X
  • Type

    conf

  • DOI
    10.1109/ICEPT.2006.359738
  • Filename
    4198859