Green IC Packages Certification

EU ROHS identified 6 substances to be banned since July 1, 2006 , while more environmentally conscious substances is being considered to be incorporated together in order to identify green compliance for IC package. Therefore, how to identify the IC package developed will be compliant with RoHS or different green rules, has been getting into more and more attention in the supply chain. Various type and PPM threshold (TLV) recognition for concerned conscious substances such as halogen substances and Sb₂O₃ even more substances from JIG is making manufacturers in supply chain confusing to follow now. In this report, the PBGA package was taken as test vehicle. The MSL performance and lead free reflow profile resistance were brought up for discussion, as well as RoHS and green material testing. Furthermore, the major material to compose of IC package like molding compound, die attach, substrate, solder ball, were subject to destructive wet digestion pretreatment then was followed by certain instrument analysis to identify the existing of Pb/Cd/Hg/Cr⁺⁶, PBBs/PBDEs, other halogen substances and Sb₂O₂. One green certification methodology for IC package will be recommended from environment compliance and technical performance perspective