DocumentCode :
2575538
Title :
Threshold voltage fluctuation induced by direct tunnel leakage current through 1.2-2.8 nm thick gate oxides for scaled MOSFETs
Author :
Koh, M. ; Iwamoto, K. ; Mizubayashi, W. ; Murakami, H. ; Ono, T. ; Tsuno, M. ; Mihara, T. ; Shibahara, Kohki ; Yokoyama, Shiyoshi ; Miyazaki, S. ; Miura, M.M. ; Hirose, M.
Author_Institution :
Res. Center for Nanodevices & Syst., Hiroshima Univ., Japan
fYear :
1998
fDate :
6-9 Dec. 1998
Firstpage :
919
Lastpage :
922
Abstract :
Influences of direct tunnel leakage current through 1.2-2.8 nm thick gate oxides on nMOSFET DC characteristics have been investigated. It is found that the statistical distribution of the direct tunnel leakage current through the ultrathin gate oxides induces significant fluctuations in the threshold voltage and the transconductance of MOSFETs when the gate oxide tunnel resistance becomes comparable to gate poly-Si resistance. By calculating based on the measured characteristics it is shown that the threshold voltage and the transconductance fluctuations will be problematic when the gate oxide thickness is scaled down to less than 1 nm.
Keywords :
MOSFET; leakage currents; tunnelling; DC characteristics; MOSFET; direct tunnel leakage current; gate oxide; statistical distribution; threshold voltage fluctuation; transconductance; Current measurement; Diodes; Etching; Fluctuations; Hafnium; Leakage current; MOSFET circuits; Thickness measurement; Threshold voltage; Transconductance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1998. IEDM '98. Technical Digest., International
Conference_Location :
San Francisco, CA, USA
ISSN :
0163-1918
Print_ISBN :
0-7803-4774-9
Type :
conf
DOI :
10.1109/IEDM.1998.746504
Filename :
746504
Link To Document :
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