DocumentCode :
2575583
Title :
An Upside-down Soldering Technique for MCM House Sealing
Author :
Xie, Qilin
Author_Institution :
No.38 Inst. of China Electr.s Technol. Group Corp., Anhui
fYear :
2006
fDate :
26-29 Aug. 2006
Firstpage :
1
Lastpage :
4
Abstract :
This paper puts forward an upside-down soldering technique for MCM house hermetic sealing with his lid. the MCM house was taken upside-down, with his lid and solder film loop grouped in advance, let the lid attach with the hot platform, then heated it to finish soldering for hermetic sealing clamps used and appropriate structure form design and optimized technical parameters to ensure the temperature on the bottom of MCM house was lower than the melting point by 30degC of solder metal attached to house. After some testing, the MCM´s electricity performance has no distinct change. This technique is very simple and credible, and it´s relatively easy to remove the lid and to solder at repairing
Keywords :
clamps; hermetic seals; multichip modules; soldering; MCM electricity performance; MCM house sealing; clamps; lid attach; solder film; solder metal; upside-down soldering technique; Clamps; Design optimization; Electronic equipment; Glass; Inorganic materials; Packaging; Soldering; Surface finishing; Temperature control; Welding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0619-6
Electronic_ISBN :
1-4244-0620-X
Type :
conf
DOI :
10.1109/ICEPT.2006.359744
Filename :
4198865
Link To Document :
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