Preparation of Conductive Particles by Electroless Nickel Plating on Polystyrene Microsphere

Author

Wang, Jia ; An, Bing ; He, Jingqiang ; Wu, Fengshun ; Wu, Yiping

Author_Institution

State Key Lab. of Plastic Forming Simulation & Die Technol., Huazhong Univ. of Sci. & Technol., Wuhan

fYear

2006

fDate

26-29 Aug. 2006

Firstpage

1

Lastpage

4

Abstract

Anisotropic conductive adhesive (ACA) is an advanced packaging material with lots of merits, but its manufacture is of high tech upon multiple branches of knowledge. In this letter, a step of preparing the conductive particles of ACA was investigated, that is, electroless nickel plating on polymer microspheres. The process of the coating formation consists of four steps: chemical etching, sensitization, activation, and electroless plating. 0.23 mum in thickness uniform and smooth Ni-P coating on 3.7 mum in diameter polystyrene microspheres was formed upon 25 min plating. The advantage of this plating process is to ensure an easy and accurate control on the thickness and the quality of the plating coat

Keywords

conductive adhesives; conductors (electric); electroless deposited coatings; electroplating; etching; nickel alloys; phosphorus alloys; 0.23 micron; 25 min; 3.7 micron; Ni-P; anisotropic conductive adhesives; coating formation; conductive particles; electroless nickel plating; packaging material; polystyrene microsphere; Anisotropic magnetoresistance; Chemical processes; Coatings; Conducting materials; Conductive adhesives; Etching; Manufacturing; Nickel; Packaging; Polymers; anisotropic conductive adhesive; electroless nickel plating; polystyrene microsphere;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on

Conference_Location

Shanghai

Print_ISBN

1-4244-0619-6

Electronic_ISBN

1-4244-0620-X

Type

conf

DOI

10.1109/ICEPT.2006.359753

Filename

4198874